Global (AMER, APAC, BRICS and EMEA) Electronic Packaging Materials Market Research Report 2019-2025 (Includes Business Impact of COVID-19)

  • TBI878042
  • November 11, 2019
  • Global
  • 134 pages
  • TSCIR
                                          

Abstract, Snapshot, Market Analysis & Market Definition: Electronic Packaging Materials Market

This report studies the Electronic Packaging Materials market. Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit. Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry. In 2019, the market size of Electronic Packaging Materials is 5023.9 million US$ and it will reach 6107.7 million US$ in 2025, growing at a CAGR of 2.8% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period. In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Electronic Packaging Materials. This report studies the global market size of Electronic Packaging Materials, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia). This study presents the Electronic Packaging Materials production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025. For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

Market Segmentation, Outlook & Regional Insights: Electronic Packaging Materials Market

Segmentation by Product Type: Breakdown of data from year 2014 to 2019 and forecast until 2025: Metal Packages Plastic Packages Ceramic Packages Segmentation by Application: Breakdown of data from year 2014 to 2019 and forecast until 2025: Semiconductor & IC PCB Others

Key Players, Recent Developments & Sector Viewpoints: Electronic Packaging Materials Market

DowDuPont Evonik EPM Mitsubishi Chemical Sumitomo Chemical Mitsui High-tec Tanaka Shinko Electric Industries Panasonic Hitachi Chemical Kyocera Chemical Gore BASF Henkel AMETEK Electronic Toray Maruwa Leatec Fine Ceramics NCI Chaozhou Three-Circle Nippon Micrometal Toppan Dai Nippon Printing Possehl Ningbo Kangqiang

Key Insights Covered: Exhaustive Electronic Packaging Materials Market

1. Market size (sales, revenue and growth rate) of Electronic Packaging Materials industry. 2. Global major manufacturers' operating situation (sales, revenue, growth rate and gross margin) of Electronic Packaging Materials industry. 3. SWOT analysis, New Project Investment Feasibility Analysis, Upstream raw materials and manufacturing equipment & Industry chain analysis of Electronic Packaging Materials industry. 4. Market size (sales, revenue) forecast by regions and countries from 2019 to 2025 of Electronic Packaging Materials industry.

Research Methodology: Electronic Packaging Materials Market

  • Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please Request a Sample Report.
  • Demand Side Primary Contributors: OEMs, Industrial Professionals, Researches, Suppliers and Distributors, Group Purchasing Organizations, Associations, Insurers, Universities, Technological Writers, Scientists, Promoters, Investors among others.
  • Supply Side Primary Contributors: Product Managers, Marketing Managers, C-Level Executives, Distributors, Market Intelligence, Regulatory Affairs Managers among others.

1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type

1.3.1 Global Electronic Packaging Materials Market Size Growth Rate by Type (2019-2025)

1.3.2 Metal Packages

1.3.3 Plastic Packages

1.3.4 Ceramic Packages
1.4  

1.4.1 Global Electronic Packaging Materials Market Share by Application (2019-2025)

1.4.2 Semiconductor & IC

1.4.3 PCB

1.4.4 Others
1.5 Study Objectives
1.6 Years Considered2 Global Growth Trends
2.1 Production and Capacity Analysis

2.1.1 Global Electronic Packaging Ma
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