Global (United States, European Union and China) Chip On Flex (COF) Market Research Report 2019-2025 (Includes Business Impact of COVID-19)

  • TBI748637
  • September 18, 2019
  • Global
  • 139 pages
  • TSCIR
                                          

Abstract, Snapshot, Market Analysis & Market Definition: World Chip On Flex (COF) Market

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver. In 2019, the market size of Chip On Flex (COF) is 1557.7 million US$ and it will reach 2119.8 million US$ in 2025, growing at a CAGR of 4.5% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period. In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Chip On Flex (COF). This report studies the global market size of Chip On Flex (COF), especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India, and Southeast Asia). This study presents the Chip On Flex (COF) production, revenue, market share, and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025. For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019

Market Segmentation, Outlook & Viewpoint: World Chip On Flex (COF) Market

Segmentation by Product Type: Breakdown of data from the year 2014 to 2019 and forecast until 2025: Single sided COF Others Segmentation by Application: Breakdown of data from the year 2014 to 2019 and forecast until 2025: Military Medical Aerospace Electronics Other

Top Companies & Key Players: World Chip On Flex (COF) Market

LGIT Stemco Flexceed Chipbond Technology CWE Danbond Technology AKM Industrial Compass Technology Company Compunetics STARS Microelectronics

Key Insights Covered: World Chip On Flex (COF) Market

1. North America, Europe, Asia Pacific, Middle East & Africa, Latin America market size (sales, revenue, and growth rate) of Chip On Flex (COF) industry. 2. Global major manufacturers' operating situation (sales, revenue, growth rate, and gross margin) of Chip On Flex (COF) industry. 3. Global major countries (United States, Canada, Germany, France, UK, Italy, Russia, Spain, China, Japan, Korea, India, Australia, New Zealand, Southeast Asia, Middle East, Africa, Mexico, Brazil, C. America, Chile, Peru, Colombia) market size (sales, revenue, and growth rate) of Chip On Flex (COF) industry. 4. SWOT analysis, New Project Investment Feasibility Analysis, Upstream raw materials and manufacturing equipment & Industry chain analysis of Chip On Flex (COF) industry. 5. Global market size (sales, revenue) forecast by regions and countries from 2019 to 2024 of Chip On Flex (COF) industry.

Research Methodology: Global Chip On Flex (COF) Market

  • Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please Request a Sample Report.
  • Demand Side Primary Contributors: OEMs, Industrial Professionals, Researches, Suppliers and Distributors, Group Purchasing Organizations, Associations, Insurers, Universities, Technological Writers, Scientists, Promoters, Investors among others.
  • Supply Side Primary Contributors: Product Managers, Marketing Managers, C-Level Executives, Distributors, Market Intelligence, Regulatory Affairs Managers among others.

 1 Report Overview    1.1 Research Scope    1.2 Major Manufacturers Covered in This Report    1.3 Market Segment by Type
1.3.1 Global Chip On Flex (COF) Market Size Growth Rate by Type (2019-2025)
1.3.2 Single sided COF
1.3.3 Others    1.4   
1.4.1 Global Chip On Flex (COF) Market Share by Application (2019-2025)
1.4.2 Military
1.4.3 Medical
1.4.4 Aerospace
1.4.5 Electronics
1.4.6 Other    1.5 Study Objectives    1.6 Years Considered2 Global Growth Trends    2.1 Production and Capacity Analysis

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