Abstract, Snapshot, Market Analysis & Market Definition: World Die Bonder Equipment Market
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-GlassDie Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue. In 2019, the market size of Die Bonder Equipment is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Die Bonder Equipment. This report studies the global market size of Die Bonder Equipment, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India, and Southeast Asia). This study presents the Die Bonder Equipment production, revenue, market share, and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025. For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019
Market Segmentation, Outlook & Viewpoint: World Die Bonder Equipment Market
Segmentation by Product Type: Breakdown of data from the year 2014 to 2019 and forecast until 2025: Fully Automatic
Semi-Automatic
Manual
Segmentation by Application: Breakdown of data from the year 2014 to 2019 and forecast until 2025:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Top Companies & Key Players: World Die Bonder Equipment Market
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond
Key Insights Covered: World Die Bonder Equipment Market
1. North America, Europe, Asia Pacific, Middle East & Africa, Latin America market size (sales, revenue, and growth rate) of Die Bonder Equipment industry.
2. Global major manufacturers' operating situation (sales, revenue, growth rate, and gross margin) of Die Bonder Equipment industry.
3. Global major countries (United States, Canada, Germany, France, UK, Italy, Russia, Spain, China, Japan, Korea, India, Australia, New Zealand, Southeast Asia, Middle East, Africa, Mexico, Brazil, C. America, Chile, Peru, Colombia) market size (sales, revenue, and growth rate) of Die Bonder Equipment industry.
4. SWOT analysis, New Project Investment Feasibility Analysis, Upstream raw materials and manufacturing equipment & Industry chain analysis of Die Bonder Equipment industry.
5. Global market size (sales, revenue) forecast by regions and countries from 2019 to 2024 of Die Bonder Equipment industry.
Research Methodology: Global Die Bonder Equipment Market
- Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please Request a Sample Report.
- Demand Side Primary Contributors: OEMs, Industrial Professionals, Researches, Suppliers and Distributors, Group Purchasing Organizations, Associations, Insurers, Universities, Technological Writers, Scientists, Promoters, Investors among others.
- Supply Side Primary Contributors: Product Managers, Marketing Managers, C-Level Executives, Distributors, Market Intelligence, Regulatory Affairs Managers among others.