Global Electronic Circuit Board Level Underfill Material Market Research Report 2019 (Includes Business Impact of COVID-19)

                                          
"The ongoing Coronavirus (COVID-19) pandemic is re-shaping everything from global economies to product categories, pricing, and stock availability to the consumer behavior. The final report is updated to address the impact of COVID-19 on the Electronic Circuit Board Level Underfill Material market.

Trusted Business Insights is tracking mining/oil and gas, transportation, employment services, travel arrangements, and the leisure and hospitality sector closely as they are likely to be the hardest-hit sectors. Utilities, local pharma, diagnostics, consumer goods and durables, agro chem and fertilizers, and telecommunications are the sectors that will be weathering the COVID-19 storm and most likely come out relatively unscathed. Interdependencies of sectors are factored in our research report on the Electronic Circuit Board Level Underfill Material market."
The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.
The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.

The global Electronic Circuit Board Level Underfill Material market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Electronic Circuit Board Level Underfill Material volume and value at global level, regional level and company level. From a global perspective, this report represents overall Electronic Circuit Board Level Underfill Material market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
    Henkel
    Namics
    AI Technology
    Protavic
    H.B. Fuller
    ASE
    Hitachi
    Indium
    Zymet
    YINCAE
    LORD
    Sanyu Rec
    Dow

Segment by Regions
    North America
    Europe
    China
    Japan

Segment by Type
    Quartz/Silicone
    Alumina Based
    Epoxy Based
    Urethane Based
    Acrylic Based
    Others

Segment by Application
    CSP (Chip Scale Package
    BGA (Ball Grid array)
    Flip Chips