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"The ongoing Coronavirus (COVID-19) pandemic is re-shaping everything from global economies to product categories, pricing, and stock availability to the consumer behavior. The final report is updated to address the impact of COVID-19 on the 3D IC & 2.5D IC Packaging market. Trusted Business Insights is tracking mining/oil and gas, transportation, employment services, travel arrangements, and the leisure and hospitality sector closely as they are likely to be the hardest-hit sectors. Utilities, local pharma, diagnostics, consumer goods and durables, agro chem and fertilizers, and telecommunications are the sectors that will be weathering the COVID-19 storm and most likely come out relatively unscathed. Interdependencies of sectors are factored in our research report on the 3D IC & 2.5D IC Packaging market." 2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board. 3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers. The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging. In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP). Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED. The global 3D IC & 2.5D IC Packaging market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025. This report focuses on 3D IC & 2.5D IC Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC & 2.5D IC Packaging market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan. At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report. The following manufacturers are covered: Intel Corporation Toshiba Corp Samsung Electronics Stmicroelectronics Taiwan Semiconductor Manufacturing Amkor Technology United Microelectronics Broadcom ASE Group Pure Storage Advanced Semiconductor Engineering Segment by Regions North America Europe China Japan Segment by Type 3D TSV 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Segment by Application Automotive Consumer electronics Medical devices Military & aerospace Telecommunication Industrial sector and smart technologies
Table of Contents Executive Summary 1 3D IC & 2.5D IC Packaging Market Overview 1.1 Product Overview and Scope of 3D IC & 2.5D IC Packaging 1.2 3D IC & 2.5D IC Packaging Segment by Type 1.2.1 Global 3D IC & 2.5D IC Packaging Production Growth Rate Comparison by Type (2014-2025) 1.2.2 3D TSV 1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) 1.3 3D IC & 2.5D IC Packaging Segment by Application 1.3.1 3D IC & 2.5D IC Packaging Consumption Comparison by Application (2014-2025) 1.3.2 Automotive 1.3.3 Consumer electronics 1.3.4 Medical devices 1.3.5 Military & aerospace 1.3.6 Telecommunication 1.3.7 Industrial sector and smart technologies 1.4 Global 3D IC & 2.5D IC Packaging Market by Region 1.4.1 Global 3D IC & 2.5D IC Packaging Market Size Region 1.4.2 North America Status and Prospect (2014-2025) 1.4.3 Europe Status and Prospect (2014-2025) 1.4.4 China Status and Prospect (2014-2025) 1.4.5 Japan Status and Prospect (2014-2025) 1.5 Global 3D IC & 2.5D IC Packaging Market Size 1.5.1 Global 3D IC & 2.5D IC Packaging Revenue (2014-2025) 1.5.2 Global 3D IC & 2.5D IC Packaging Production (2014-2025) 2 Global 3D IC & 2.5D IC Packaging Market Competition by Manufacturers 2.1 Global 3D IC & 2.5D IC Packaging Production Market Share by Manufacturers (2014-2019) 2.2 Global 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019) 2.3 Global 3D IC & 2.5D IC Packaging Average Price by Manufacturers (2014-2019) 2.4 Manufacturers 3D IC & 2.5D IC Packaging Production Sites, Area Served, Product Types 2.5 3D IC & 2.5D IC Packaging Market Competitive Situation and Trends 2.5.1 3D IC & 2.5D IC Packaging Market Concentration Rate 2.5.2 3D IC & 2.5D IC Packaging Market Share of Top 3 and Top 5 Manufacturers ... | read more...