Report updated on 11th September, 2021: Global Integrated Passive Devices Market 2021 (Includes Business Impact of COVID-19)
Global Integrated Passive Devices Market Analysis Trends, Applications, Analysis, Growth, and Forecast to 2030 is a recent report generated by Trusted Business Insights. The global integrated passive devices market report has been segmented on the basis of application, end-use industry, and region.
Request Covid - 19 Impact
The global Integrated Passive Devices market size was valued at USD$ 1.07 billion in 2020 and is projected to reach $2.36 billion by 2030, and is anticipated to expand at a CAGR of 8.25% over the forecast period from 2020 to 2030.
Global Integrated Passive Devices Market: Overview
Integrated passive devices (IPD), also known as integrated passive components is a technology that offers trade-off for system-in-package (SiP) solutions. Passive devices such as capacitors, resistors, inductors, and others, are building blocks of electronic devices, organized in different combinations for various applications. Passive devices are essential parts of SiP solutions and are used for biasing, decoupling, resonating, transforming, etc. Integrated passive devices have various applications in RF power amplifier matching/filters/couplers, front end modules (FEM), functional interposers, GPS systems, and others. IPDs are cost-effective as it improves yield, reliability, component tolerance, reduce interconnection complexity, and reduce footprint.
Global Integrated Passive Devices Market: Dynamics
Rising demand for integrated passive devices in automotive industry for various applications such as infotainment, GPS, battery management system, and others, is a major factor expected to drive growth of the global integrated passive devices market. Increasing adoption of EMS and EMI protection IPD for implanted medical devices owing to thwart network signal interference. This is another factor expected to fuel growth of the potential market. Furthermore, increasing demand for consumer electronics, coupled with rising demand for high performance and miniaturized electronic devices, and growing demand for IPDs in RF applications, are among some other factors projected to support revenue growth of the target market to a certain extent.
However, high cost of integrated passive devices as compared to discrete components is a major factor which may hamper growth of the global market to certain extent.
Increasing use of IPDs in wearable industry and technological advancements for innovative and efficient devices are among some other factors anticipated to create opportunities for the manufacturers, and is expected to augment growth of the target market.
Global Integrated Passive Devices Market: Segment Analysis
Among application segments, the EMS and EMI Protection IPD segment is expected to register for significant revenue share in the target market, owing to increasing demand of these IPDs in cellular devices.
Among end-use industry segments, the consumer electronics segment is expected to account for highest revenue growth in the potential market, owing to increasing demand for smartphones, tablets, and others.
Global Integrated Passive Devices Market: Regional Analysis
The Asia Pacific integrated passive devices market is estimated to account for significant revenue share, and expected to dominate in the global integrated passive devices market over the forecast period. This dominance can be attributed to growing adoption of IoT devices, increasing consumer electronics, automotive, and other industries in countries in Asia Pacific region. The Asia Pacific market is projected to register fastest growth rate in the next 10 years, owing to increasing R&D and investments by government and manufacturers in various industries. The North America integrated passive devices market is expected to register for moderate revenue share in the target market. Rising demand for integrated passive devices in various end-use industries such as healthcare, automotive, electronics, and others in the region.
Below are the active patents related to Integrated Passive Devices Market.
Patent Number: US7759212B2
System-in-package having integrated passive devices and method therefor
Abstract
A method of manufacturing a semiconductor device involves providing a substrate, forming a first passivation layer over the substrate, and forming an integrated passive circuit over the substrate. The integrated passive circuit can include inductors, capacitors, and resistors. A second passivation layer is formed over the integrated passive circuit. System components are mounted to the second passivation layer and electrically connect to the second conductive layer. A mold compound is formed over the integrated passive circuit. A coefficient of thermal expansion of the mold compound is approximately equal to a coefficient of thermal expansion of the system component. The substrate is removed. An opening is etched into the first passivation layer and solder bumps are deposited over the opening in the first passivation layer to electrically connect to the integrated passive circuit. A metal layer can be formed over the molding compound or first passivation layer for shielding.
Application File Date: 2007-12-26
Application Granted Date: 2010-07-20
Current Assignee: Stats Chippac Pte Ltd
Patent Number: US20100060375A1
Balun circuit manufactured by integrate passive device process
Abstract
A Balun circuit manufactured by integrate passive device (IPD) process. The Balun circuit includes a substrate, a first coplanar spiral structure, and a second coplanar spiral structure. One end of the innermost first left coil of the first coplanar spiral structure is electrically connected to the innermost first right coil through a first bridge. Two ends of the first coplanar spiral structure are electrically connected to the outermost first left coil and the outermost right coil respectively. One end of the innermost second left coil of the second coplanar spiral structure is electrically connected to the innermost second right coil through a second bridge. Two ends of the second coplanar spiral structure are electrically connected to the outermost second left coil and the outermost second right coil respectively. The first left coils and the second left coils are interlaced. The first right coils and the second right coils are interlaced.
Application File Date: 2009-02-24
Application Granted Date: 2011-08-30
Current Assignee: Advanced Semiconductor Engineering Inc
Global Integrated Passive Devices Market Segmentation:
Segmentation on the Basis of Application:
- RF IPD
- LED Lighting
- EMS and EMI Protection IPD
- Digital & Mixed Signal IPD
Segmentation on the Basis of End-use Industry:
- Automotive
- Aerospace & Defense
- Consumer Electronics
- Healthcare & Lifesciences
Key Market Players included in the report:
- 3DiS Technologies (3Dis) (France)
- Advanced Furnace Systems Corp. (AFSC) (Taiwan).
- Amkor Technology Inc.
- Broadcom.
- Infineon Technologies AG (Infineon) (Germany)
- IPDiA
- JCET Group Co.Ltd.
- Johanson Technology Inc. (Johanson) (US)
- Murata Manufacturing Co.Ltd. (Murata) (Japan)
- NXP Semiconductors.
- ON Semiconductor Corporation (ON Semiconductor) (US)
- OnChip DevicesInc. (OnChip Devices) (US)
- Qorvo Inc
- Semiconductor Components Industries LLC
- STATS ChipPAC Pte. Ltd. (Stats ChipPac) (Singapore)
- STMicroelectronics N.V. (STMicroelectronics) (Switzerland)
- Texas Instruments Incorporated
- TSMC Ltd.
Below are the key development related to Integrated Passive Devices Market in 2020 and 2021.
July 2021: Abracon Acquires Proant AB and Proant Asia Limited. Abracon, LLC (Abracon), an industry leader in passive components, announced the successful acquisitions of Proant AB and Proant Asia Limited, privately held antenna suppliers headquartered in Umeå, Sweden and Hong Kong, respectively. The combined companies will form Abracons new ProAnt brand. Abracon will retain facilities in both Sweden and Hong Kong. The addition of Proant is Abracons first acquisition in the antenna space and is an important strategic building block in Abracons overall antenna products strategy.
Source
July 2020: Analog Devices set to acquire Maxim Integrated. Analog Devices has announced that it is to acquire Maxim Integrated Products, in an all stock transaction that values the combined enterprise at over $68 billion. The transaction, which is said to value Maxim at $21bn, has been unanimously approved by the Boards of Directors of both companies and is seen as strengthening ADI providing increased breadth and scale across multiple end markets - in particular the automotive and 5G markets.
Source
February 2020: Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand. Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that it has acquired Integrand Software, Inc. to further accelerate innovation in the 5G RF communications space. Integrand’s EMX® technology has the industry-leading Method of Moments (MoM) solver technology for analysis and extraction and enables designers to accurately and efficiently simulate large integrated circuits (ICs) and advanced packages, characterize passive components and analyze interconnect parasitics in 3D-IC systems.
Source
