Advanced Packaging Market - By Type (3D Integrated Circuit Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Fan Out Wafer Level Package, Fan Out Silicon In Package, Flip Chip, Wafer Level Chip Scale Package, and Others), By Industry Vertical (IT & Telecommunication, Consumer Electronics, Automotive & Transport, Industrial, Aerospace & Defense, Healthcare, and Others)-Global Industry Analytics, COVID-19 Business Impact, and Trends, 2020 – 2029

                                          
Abstract
                    
The global advanced packaging market value was estimated at 3,715.78 (USD Million) in 2019 and is projected to hit 7,677.29 (USD Million) by 2025 growing at a CAGR of 11% during the period from 2019 to 2025. The report offers valuation and analysis of the advanced packaging market on a global as well as regional level. The study offers a comprehensive assessment of the industry competition, restraints, revenue estimates, avenues, current & emerging trends, and industry-validated market information. The report offers historical data from 2016 to 2018 along with a forecast from 2019 to 2025 based on value (USD Million).

Introduction

Advanced packaging has brought a paradigm shift in the chip manufacturing sector and is anticipated to bring huge transformation semiconductor fabrication methods. Apart from this, foundries have benefited to a large extent due to the advanced packaging automation.

Market Growth Dynamics

Growing necessity for high performing chips in various consumer electronics devices is likely to assist the advanced packaging market growth gain momentum over the forecast timeline. Furthermore, humungous demand for 3D Integrated Circuitand 2.5D packaging in chips that are utilized in smartphones will foster the demand for the advanced packaging during the ensuing years. In addition to this, large-scale acceptance of next-gen semiconductor tool is predicted to scale up the use of myriad advanced packaging methods, thereby steering the industry trends.

Furthermore, the changing customer trends for new packaging technologies and continuous breakthroughs made by key players for electronic items is likely to generate huge market demand over the forthcoming years. Additionally, the flourishing IoT sector is expected to culminate into demand for semiconductor packaging. Apparently, rise in the demand for consumer wearable goods and home equipment will favorably influence the market growth over the period from 2019 to 2025.

Our study provides the breakthroughs witnessed in the industry and the competitive business strategies implemented by the market participants for expanding their business portfolio. Let us discuss a few of the strategic moves made by the reputed brands influencing the advanced packaging market surge.


ACM Research Launches Ultra SFP Application Tool For Advanced Packaging Solutions

In a major breakthrough that can positively impact the advanced packaging business, in March 2020, ACM Research, Inc., a key dealer in water processing services for both advanced wafer level packaging & semiconductors, launched an Ultra SFP App platform for advanced packing applications. Furthermore, the Ultra SFP App is devised to resolve the problems pertaining to output caused as a result of through- silicon via methods along with fanning out wafer level packaging issues that hamper fanning out wafer level packaging procedures.

Asia Pacific To Contribute Massively Towards Overall Market Surge By 2025

The growth of the regional market during the forecast timeline is owing to huge end-user demand for advanced packaging in the countries like China and India.

Key players profiled in global advanced packaging market include International Business Machines Corporation (IBM), Amkor Technology, ASE Group, Precision Industries Co., Ltd., Qualcomm Technologies, Inc., STATS ChipPAC Pte. Ltd., Siliconware, SSS MicroTec AG., Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., and Taiwan Semiconductor Manufacturing Company.

The global advanced packaging market is segmented as follows:

By type

	3D Integrated Circuit
	2D Integrated Circuit
	2.5D Integrated Circuit
	Wafer Level Chip Scale Package
	Flip Chip
	Fan Out Silicon in Package
	Fan Out Wafer Lever Package
	Others

By industry vertical

	Consumer Electronics
	Automotive & Transport
	IT & Telecommunication
	Industrial
	Healthcare
	Aerospace & Defense
	Others

By Region

	North America
	
		The U.S.
		Canada
	
	
	Europe
	
		France
		The UK
		Spain
		Germany
		Italy
		Rest of Europe
	
	
	Asia Pacific
	
		China
		Japan
		India
		South Korea
		Southeast Asia
		Rest of Asia Pacific
	
	
	Latin America
	
		Brazil
		Mexico
		Rest of Latin America
	
	
	Middle East & Africa
	
		GCC
		South Africa
		Rest of Middle East & Africa