China Printed Circuit Board Laminate Market and Forecast 2020-2026

                                          
Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.

Market Analysis and Insights: Global Printed Circuit Board Laminate Market


This report focuses on Global Printed Circuit Board Laminate market.
The China Printed Circuit Board Laminate market size is projected to reach US$ XX million by 2026, from US$ XX million in 2020, at a CAGR of XX% during 2021-2026.

China Printed Circuit Board Laminate Scope and Market Size

Printed Circuit Board Laminate market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Printed Circuit Board Laminate market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.

Segment by Type, the Printed Circuit Board Laminate market is 
segmented into

Rigid 1-2Sided
Standard Multilayer
HDI/Microvia/Build-Up
IC Substrate
Flexible Circuits
Rigid Flex
Others

Segment by Application, the Printed Circuit Board Laminate market is segmented into

Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others

Regional and Country-level Analysis

The Printed Circuit Board Laminate market is analysed and market size information is provided by regions (countries).
The key regions covered in the Printed Circuit Board Laminate market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.

Competitive Landscape and Printed Circuit Board Laminate Market Share Analysis

Printed Circuit Board Laminate market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Printed Circuit Board Laminate business, the date to enter into the Printed Circuit Board Laminate market, Printed Circuit Board Laminate product introduction, recent developments, etc.

The major vendors covered:

Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG'