Abstract, Snapshot, Market Analysis & Market Definition: 3D Semiconductor Packaging Market
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip chip to achieve vertical stacks. Examples of 3D packages include package-on-package (PoP) where individual die are packaged, and the packages are stacked and interconnected with wire bonds or flip chip processes; and 3D wafer-level packaging (3D WLP) that uses redistribution layers (RDL) and bumping processes to form interconnects. Consumer Electronics industry contributed over 54% of the overall 3D semiconductor packaging market in 2018. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 17.82% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide. In 2018, the global 3D Semiconductor Packaging market size was 1751.8 million US$ and it is expected to reach 5266.4 million US$ by the end of 2025, with a CAGR of 16.8% during 2019-2025. This report focuses on the global 3D Semiconductor Packaging status, future forecast, growth opportunity, key market and key players. The study objectives are to present the 3D Semiconductor Packaging development in United States, Europe and China.
Market Segmentation, Outlook & Regional Insights: 3D Semiconductor Packaging Market
Segmentation by Product Type: Breakdown of data from year 2014 to 2019 and forecast until 2025:
3D Wire Bonding
3D TSV
3D Fan Out
Others3D Wire Bonding Occupy the largest market share segment reached 44%
Segmentation by Application : Breakdown of data from year 2014 to 2019 and forecast until 2025:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
OthersConsumer Electronics has the largest market share segment with 54% and the fastest growth
Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America
Key Players, Recent Developments & Sector Viewpoints: 3D Semiconductor Packaging Market
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
Key Insights Covered: Exhaustive 3D Semiconductor Packaging Market
1. Market size (sales, revenue and growth rate) of 3D Semiconductor Packaging industry.
2. Global major manufacturers' operating situation (sales, revenue, growth rate and gross margin) of 3D Semiconductor Packaging industry.
3. SWOT analysis, New Project Investment Feasibility Analysis, Upstream raw materials and manufacturing equipment & Industry chain analysis of 3D Semiconductor Packaging industry.
4. Market size (sales, revenue) forecast by regions and countries from 2019 to 2025 of 3D Semiconductor Packaging industry.
Research Methodology: 3D Semiconductor Packaging Market
- Data collection and base year analysis is done using data collection modules with large sample sizes. The market data is analyzed and forecasted using market statistical and coherent models. Also market share analysis and key trend analysis are the major success factors in the market report. To know more please Request a Sample Report.
- Demand Side Primary Contributors: OEMs, Industrial Professionals, Researches, Suppliers and Distributors, Group Purchasing Organizations, Associations, Insurers, Universities, Technological Writers, Scientists, Promoters, Investors among others.
- Supply Side Primary Contributors: Product Managers, Marketing Managers, C-Level Executives, Distributors, Market Intelligence, Regulatory Affairs Managers among others.