Global Automatic Mounter Wafer Equipment Market Research Report 2019 (Includes Business Impact of COVID-19)

                                          
"The ongoing Coronavirus (COVID-19) pandemic is re-shaping everything from global economies to product categories, pricing, and stock availability to the consumer behavior. The final report is updated to address the impact of COVID-19 on the Automatic Mounter Wafer Equipment market.

Trusted Business Insights is tracking mining/oil and gas, transportation, employment services, travel arrangements, and the leisure and hospitality sector closely as they are likely to be the hardest-hit sectors. Utilities, local pharma, diagnostics, consumer goods and durables, agro chem and fertilizers, and telecommunications are the sectors that will be weathering the COVID-19 storm and most likely come out relatively unscathed. Interdependencies of sectors are factored in our research report on the Automatic Mounter Wafer Equipment market."
Wafer mounters are a part of the wafer fabrication process. After wafer grinding is carried out, the wafer is mounted on a metal frame for film or tape to be applied to it. This process is called wafer mounting. Automatic mounter wafer equipment is the hand operation free equipment, used for wafer mounting. Automatic Wafer Mounting System is designed to automatically mount wafers on tape.

The global Automatic Mounter Wafer Equipment market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Automatic Mounter Wafer Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Automatic Mounter Wafer Equipment market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
    DISCO Corp.
    Syagrus Systems
    Advanced Dicing Technologies
    Longhill Industries
    Lintec Corporation
    Nitto Denko
    Tokyo Electron
    Technovision
    Takatori
    Ultron Systems

Segment by Regions
    North America
    Europe
    China
    Japan

Segment by Type
    100 mm Wafer Size
    150 mm Wafer Size
    200 mm Wafer Size
    300 mm Wafer Size
    Other

Segment by Application
    Dicing
    Protection (Back Grinding)
    DAF (Die Attached Film)
    Others