Semiconductor and IC Packaging Material Market By Type (Lead Frames, Bonding Wires, Ceramic Packages, Organic Substrates, and Others) and By Packaging Technology (DFN, GA, QFN, SOP, and Others)-Global Industry Analytics, Comprehensive Analysis, And Forecast, 2020–2029
- TBI85060
- July 24, 2020
- Global
- 132 pages
- SAC Insights
Abstract
The report analyzes and forecasts the semiconductor and IC packaging material market on a global and regional level. The study offers past data from 2016 to 2018 along with a forecast from 2019 to 2025 based on revenue (USD Billion). The assessment of semiconductor and IC packaging material market dynamics gives a brief thought about the market drivers and restraints along with their impact on the demand over the years to come. Additionally, the report also includes the study of opportunities available in the semiconductor and IC packaging material market on a global level.
The report gives a transparent view of the semiconductor and IC packaging material market. We have included a detailed competitive scenario and portfolio of the leading vendors operating in the semiconductor and IC packaging material market. To understand the competitive landscape in the semiconductor and IC packaging material market, an analysis of Porter’s Five Forces model for the market has also been included. The study encompasses a market attractiveness analysis, wherein all the segments are benchmarked based on their market size, growth rate, and general attractiveness.
The study provides a crucial view of the semiconductor and IC packaging material market by segmenting it based on type, packaging technology, and region. All the segments of semiconductor and IC packaging material market have been analyzed based on present and future trends and the market is estimated from 2019 to 2025. The regional segmentation comprises the current and forecast demand for the Middle East and Africa, North America, Asia Pacific, Latin America, and Europe.
Some key players of the semiconductor and IC packaging material market globally are Amkor Technology, DuPont, Henkel, Honeywell, Toppan Printing, Hitachi Chemical, Kyocera Chemical, LG Chemical, Alent, BASF, Sumitomo Chemical, Toray Industries Corporation, Mitsui High-Tec, and Tanaka Holdings.
This report segments the global semiconductor and IC packaging material market into:
Global Semiconductor and IC Packaging Material Market: By Type
Lead Frames
Bonding Wires
Ceramic Packages
Organic Substrates
Others
Global Semiconductor and IC Packaging Material Market: By Packaging Technology
DFN
GA
QFN
SOP
Others
Global Semiconductor and IC Packaging Material Market: By Region
North America
The U.S.
Europe
UK
France
Germany
Asia Pacific
China
Japan
India
Latin America
Brazil
Middle East and Africa
Table of Contents
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Chapter 1. Preface
1.1. Report Description
1.1.1. Objective
1.1.2. Target Audience
1.1.3. Unique Selling Proposition (USP) & Offerings
1.2. Research Scope
1.3. Research Methodology
1.3.1. Market Research Process
1.3.2. Market Research Methodology
1.3.3. Level 1: Primary Research
1.3.4. Level 2: Secondary Research
1.3.5. Le
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