Global HTCC & LTCC Substrate Market By Product Type (Htcc And Ltcc), By Application (Semiconductor, Optics, Telecommunication, Military, Automotive), By Region, And Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends And Forecast 2021-2030 (Includes Business Impact of COVID-19)

                                          
Report updated on 11th September, 2021: Global HTCC & LTCC Substrate Market By Product Type (Htcc And Ltcc), By Application (Semiconductor, Optics, Telecommunication, Military, Automotive), By Region, And Key Companies - Industry Segment Outlook, Market Assessment, Competition Scenario, Trends And Forecast 2019-2029 (Includes Business Impact of COVID-19)
Trusted Business Insights has published a comprehensive market research report on, Global HTCC & LTCC Substrate Market by Product Type (HTCC and LTCC), By Application (Semiconductor, Optics, Telecommunication, Military, Automotive and Other Applications), and by Region -Global Forecast to 2030, which offers a holistic view of the global HTCC & LTCC substrate market through systematic segmentation that covers every aspect of the target market.

The global HTCC & LTCC substrate market is projected to be US$ 950.5 Mn in 2020 to reach US$ 1,485.7 Mn by 2030 at a CAGR of 4.6%.

Co-fired ceramic is made with a combination of the ceramic substrate and conducting metals that are co-fired at a certain temperature to achieve multi-layered and compact devices. Co-fired ceramic technology offers various advantages such as they are chemically inactivity, have excellent physical and high thermal stability properties, non-corrosiveness, and environmental resistance. Co-fired ceramics are used in different industries such as aerospace & defense, automotive, telecommunications, medical, semiconductor, and other industrial applications. There are two basic product types for co-fired ceramic namely LTCC (Low-Temperature Co-fired Ceramic) and HTCC (High-Temperature Co-fired Ceramic). The advantages of LTCC are lower permittivity tolerance, have stable thermal conductivity, release lower trichloroethylene. The advantages of HTCC are high mechanical stability, high temperature stability of around 1,600 °C (2,910 °F), easy to integrate into metal housings.

Higher usage of low temperature and high-temperature ceramics substrate for semiconductor packaging in numerous applications such as industrial power, medical, oil exploration, propulsion systems, satellites, energy storage, and directed energy is projected to gain significant market growth in coming years


Global HTCC & LTCC Substrate Market Revenue (US$ Mn), 2019“2029


However, high cost of ceramic substrates compared to metals and alloys substrates is a major factor expected to restrain the market growth of the global HTCC and LTCC substrate market. Moreover, increasing demand for advanced ceramic substrate for high power & high-frequency applications such as the establishment of reliable communications channels, interferometric systems, and others. This is expected to provide growth opportunities for the key players operating in the global HTCC and LTCC substrate market.

Global HTCC & LTCC substrate market is segmented on the basis of product type, application and region. On the basis of product type, the market is segmented into HTCC & LTCC. The LTCC segment accounts for the majority share and is expected to register highest revenue growth over forecast period. On the basis of Application, the market is segmented into semiconductor, optics, telecommunication, military, automotive, other applications. The semiconductor segment accounts for the highest market share in the global HTCC & LTCC substrate market.


Global HTCC & LTCC Substrate Market by Type, 2019


On the basis of region, the market is segmented into North America, Europe, APAC, South America and MEA. The APAC accounts for the majority share in the global HTCC & LTCC substrate market owing to the presence of a large number of co-fired ceramic manufacturers in the country in the region. North America is followed by Europe owing to increasing telecommunications and consumer electronics industry. Regions such as South America and MEA are expected to register stable growth over the forecast period.

The research report on the global HTCC & LTCC substrate market includes profiles of some of major companies such as KYOCERA Corporation, Chaozhou Three-circle (Group) Co., Hitachi, Ltd., SEMCNS Co., Ltd., KOA Corporation, Murata Manufacturing Co., Ltd., NGK Spark Plug Co., Ltd., NEO Tech, AMETEK, Inc., AdTech Ceramics, CeramTec GmbH, CoorsTek Inc., Maruwa Co., Ltd., Yokowo Co., Ltd.



Below are the active patents related to HTCC & LTCC Substrate Market.


Patent Number: US20050156689A1

Method for tuning the center frequency of embedded microwave filters

Abstract

A method of tuning the frequency response of filters embedded in or formed on a ceramic substrate, such as but not limited to a low temperature co-fired ceramic substrate (LTCC), by re-firing a previously fired LTCC substrate to a temperature which is greater by a predetermined, relatively small, amount than that of the temperature produced during the original firing profile of the substrate so as to change the dielectric constant of the substrate, and thus cause a desired shift in the filters frequency response.

Application File Date: 2004-01-16

Application Granted Date: 2006-04-18

Current Assignee: Northrop Grumman Systems Corp

Patent Number: US7086786B2

Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology

Abstract

A high performance ceramic block for use with small-scale circuitry is described. The block can be used in an optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA) is formed. The block includes a first surface and a second surface and is formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC) techniques. Photonic devices are formed on the first surface of the ceramic block and electrical contacts are formed on a second surface of the block. The electrical contacts being suitable for electrical communication with a chip sub-assembly. Electrical connections are formed so that they pass internally through the ceramic block to electrically interconnect the photonic devices on the first face of the block with the electrical contacts on the second face of the block. Such a block can be advantageously used to form an optoelectronic module.

Application File Date: 2004-05-18

Application Granted Date: 2006-08-08

Current Assignee: National Semiconductor Corp

Patent Number: US20140070394A1

Semiconductor device

Abstract

In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.

Application File Date: 2013-02-26

Application Granted Date: 2015-05-12

Current Assignee: Murata Manufacturing Co Ltd

Key Market Segments

By Type

  
HTCC
  
LTCC

By Application

  
Semiconductor
  
Optics
  
Telecommunication
  
Military
  
Automotive


Key Market Players included in the report:


  
ACX Corp.
  
AdTech Ceramics
  
AMETEK Inc.
  
API Technologies
  
CeramTec GmbH
  
Chaozhou Three-circle (Group) Co.
  
CoorsTek Inc.
  
ECRI Microelectronics
  
EGIDE.
  
Hitachi Metals Ltd.
  
KOA Speer Electronics
  
KYOCERA Corporation
  
MARUWA Co.Ltd.
  
Micro Systems Technologies
  
Murata Manufacturing Co.Ltd.
  
NATEL ENGINEERING CO.
  
NEO Tech
  
NGK SPARK PLUG CO.,LTD.
  
Nikko Company
  
SCHOTT AG
  
Selmic Oy
  
SEMCNS Co. Ltd.
  
Soar Technology Co.
  
TDK Corporation.
  
Yokowo co.ltd


Below are the key development related to HTCC & LTCC Substrate Market in 2020 and 2021
.

July 2021: BC Partners launches sale of industrial ceramics group Ceramtec, sources say. Buyout group BC Partners has launched an auction process for Ceramtec in a deal that could value the German maker of industrial ceramics at roughly 3.5 billion euros ($4.1 billion), including debt, people close to the matter said. Ceramtec’s products are used in artificial hips and dental implants and the thermal management of car batteries, as well as circuit carriers and heat sinks in electronic applications. BC Partners is working with Bank of America and Morgan Stanley on the sale and has asked for first round bids by the end of July, the people said, adding that BC Partners launched the sale after attracting strong interest. Peers such as Celanese and CoorsTek are expected to hand in offers as are private equity groups such as a consortium of CVC and Partners Group, they said. Source

June  2021: TMC Announces the Addition of Photon Lines Optica SL as Distributor for Spain and Portugal. PEABODY, MA  AMETEK TMC, the industry leader in advanced floor vibration cancellation technology, is pleased to announce a partnership with Photon Lines Optica SL to better support and serve customers in Spain and Portugal. Source

April 2021: AMETEK TMC Announces New Distribution Partner, Lynx, to Better Serve Customers in Brazil. AMETEK TMC, the industry leader in advanced floor vibration cancellation technology, has proudly established a new partnership with Lynx to better serve its customers in Brazil. Source

February 2021: Renesas Acquires Dialog Semiconductor in $6 Billion Deal. Japanese leader in microcontrollers and automotive chips, Renesas, will buy Dialog Semiconductor, one of Apple’s suppliers, in an all-cash deal. The announcement of the agreement comes following recent speculation that the two companies were in talks, saying yesterday that the acquisition has been approved by the boards of directors of both companies. It’s also the first big acquisition to be announced following what was a blockbuster year for the semiconductor industry in terms of high-profile mergers as global semiconductor sales continue to rise. Both companies’ shares fell shortly after the announcement due to concerns about Renesas’ balance sheet. Renesas, which is one of the world’s largest suppliers of automotive systems-on-chip (SoC), spent $7.2 billion on its acquisition of IDT in 2019. Source